9icnet provides you with APF30305 designed and produced by Panasonic Electric Works, which is sold in 9icnet on the spot, and can be purchased through channels such as the original factory and agents. APF30305 price reference $12.80000. Panasonic Electric Works APF30305 Package/Specification: RELAY GENERAL PURPOSE SPDT 6A 5V. You can download APF30305 english data, pin diagram, Datasheet data sheet function manual, the data contains detailed pin diagrams of diode rectifiers, application circuit diagrams of functions, voltages, usage methods and tutorials.
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The APF30-30-13CB is HEATSINK LOW-PROFILE FORGED, that includes Black Color, they are designed to operate with a Aluminum Material, Series is shown on datasheet note for use in a APF, that offers Product features such as Heat Sinks, Type is designed to work in Top Mount, as well as the Bulk Packaging, the device can also be used as SMD/SMT Mounting Style. In addition, the Height is 12.7 mm, the device is offered in 1.181" (30.00mm) Length, the device has a 1.181" (30.00mm) of Width, and Shape is Square, Fins, and the Package Cooled is Assorted (BGA, LGA, CPU, ASIC...), and Attachment Method is Thermal Tape, Adhesive (Not Included), and the Height Off Base Height of Fin is 0.500" (12.70mm), and Thermal Resistance Forced Air Flow is 2.5°C/W @ 200 LFM, and the Material Finish is Black Anodized, and Designed for is BGA PGA PLCC QFP, and the Thermal Resistance is 2.45 C/W, and Fin Style is Vertical Fin.
The APF30-30-13CB/A01 is HEATSINK FORGED W/ADHESIVE TAPE, that includes 1.181" (30.00mm) Width, they are designed to operate with a Top Mount Type, Thermal Resistance Forced Air Flow is shown on datasheet note for use in a 2.5°C/W @ 200 LFM, that offers Thermal Resistance features such as 2.45 C/W, Shape is designed to work in Square, Fins, as well as the APF Series, the device can also be used as Heat Sinks Product. In addition, the Package Cooled is Assorted (BGA, LGA, CPU, ASIC...), the device is offered in Adhesive Mounting Style, the device has a Black Anodized of Material Finish, and Material is Aluminum, and the Length is 1.181" (30.00mm), and Height Off Base Height of Fin is 0.500" (12.70mm), and the Height is 12.7 mm, and Fin Style is Vertical Fin, and the Designed for is BGA PGA PLCC QFP, and Color is Black, and the Attachment Method is Thermal Tape, Adhesive (Included).
The APF30-30-10CB/A01 is HEATSINK FORGED W/ADHESIVE TAPE, that includes Thermal Tape, Adhesive (Included) Attachment Method, they are designed to operate with a 0.370" (9.40mm) Height Off Base Height of Fin, Length is shown on datasheet note for use in a 1.181" (30.00mm), that offers Material features such as Aluminum, Material Finish is designed to work in Black Anodized, as well as the Assorted (BGA, LGA, CPU, ASIC...) Package Cooled, the device can also be used as APF Series. In addition, the Shape is Square, Fins, the device is offered in 3.3°C/W @ 200 LFM Thermal Resistance Forced Air Flow, the device has a Top Mount of Type, and Width is 1.181" (30.00mm).
