9icnet provides you with APF19-19-13CB designed and produced by CTS Thermal Management Products, which is sold in 9icnet on the spot, and can be purchased through channels such as the original factory and agents. APF19-19-13CB price reference $49.156. CTS Thermal Management Products APF19-19-13CB Package/Specification: HEATSINK LOW-PROFILE FORGED. You can download APF19-19-13CB english data, pin diagram, Datasheet data sheet function manual, the data contains detailed pin diagrams of diode rectifiers, application circuit diagrams of functions, voltages, usage methods and tutorials.
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The APF19-19-06CB/A01 is HEATSINK FORGED W/ADHESIVE TAPE, that includes Black Color, they are designed to operate with a Aluminum Material, Series is shown on datasheet note for use in a APF, that offers Product features such as Heat Sinks, Type is designed to work in Top Mount, as well as the Bulk Packaging, the device can also be used as Adhesive Mounting Style. In addition, the Height is 6.3 mm, the device is offered in 0.748" (19.00mm) Length, the device has a 0.748" (19.00mm) of Width, and Shape is Square, Fins, and the Package Cooled is Assorted (BGA, LGA, CPU, ASIC...), and Attachment Method is Thermal Tape, Adhesive (Included), and the Height Off Base Height of Fin is 0.250" (6.35mm), and Thermal Resistance Forced Air Flow is 7.1°C/W @ 200 LFM, and the Material Finish is Black Anodized, and Designed for is BGA PGA PLCC QFP, and the Heatsink Material is Aluminum, and Thermal Resistance is 7.05 C/W, and the Fin Style is Vertical Fin.
The APF19-19-10CB/A01 is HEATSINK FORGED W/ADHESIVE TAPE, that includes 0.748" (19.00mm) Width, they are designed to operate with a Top Mount Type, Thermal Resistance Forced Air Flow is shown on datasheet note for use in a 5.3°C/W @ 200 LFM, that offers Thermal Resistance features such as 5.25 C/W, Shape is designed to work in Square, Fins, as well as the APF Series, the device can also be used as Heat Sinks Product. In addition, the Packaging is Tray, the device is offered in Assorted (BGA, LGA, CPU, ASIC...) Package Cooled, the device has a Adhesive of Mounting Style, and Material Finish is Black Anodized, and the Material is Aluminum, and Length is 0.748" (19.00mm), and the Height Off Base Height of Fin is 0.370" (9.40mm), and Height is 9.5 mm, and the Heatsink Material is Aluminum, and Fin Style is Vertical Fin, and the Designed for is BGA PGA PLCC QFP, and Color is Black, and the Attachment Method is Thermal Tape, Adhesive (Included).
The APF19-19-10CB is HEATSINK LOW-PROFILE FORGED, that includes Thermal Tape, Adhesive (Not Included) Attachment Method, they are designed to operate with a Black Color, Designed for is shown on datasheet note for use in a BGA PGA PLCC QFP, that offers Fin Style features such as Vertical Fin, Height is designed to work in 9.5 mm, as well as the 0.370" (9.40mm) Height Off Base Height of Fin, the device can also be used as 0.748" (19.00mm) Length. In addition, the Material is Aluminum, the device is offered in Black Anodized Material Finish, the device has a SMD/SMT of Mounting Style, and Package Cooled is Assorted (BGA, LGA, CPU, ASIC...), and the Product is Heat Sinks, and Series is APF, and the Shape is Square, Fins, and Thermal Resistance is 5.25 C/W, and the Thermal Resistance Forced Air Flow is 5.3°C/W @ 200 LFM, and Type is Top Mount, and the Width is 0.748" (19.00mm).
