9icnet provides you with APF30205 designed and produced by Panasonic Electric Works, which is sold in 9icnet on the spot, and can be purchased through channels such as the original factory and agents. APF30205 price reference $11.712. Panasonic Electric Works APF30205 Package/Specification: RELAY GEN PURPOSE SPDT 6A 5V. You can download APF30205 english data, pin diagram, Datasheet data sheet function manual, the data contains detailed pin diagrams of diode rectifiers, application circuit diagrams of functions, voltages, usage methods and tutorials.
Prices and stocks marked on 9icnet are for reference only. If you don't find what you are looking for, you can contact us by email or online message, such as APF30205 price, stock quantity, data sheet and manufacturer. We look forward to your contact and provide you with quality service.
The APF19-19-13CB/A01 is HEATSINK FORGED W/ADHESIVE TAPE, that includes Black Color, they are designed to operate with a Aluminum Material, Series is shown on datasheet note for use in a APF, that offers Product features such as Heat Sinks, Type is designed to work in Top Mount, as well as the Tube Packaging, the device can also be used as Adhesive Mounting Style. In addition, the Height is 12.7 mm, the device is offered in 0.748" (19.00mm) Length, the device has a 0.748" (19.00mm) of Width, and Shape is Square, Fins, and the Package Cooled is Assorted (BGA, LGA, CPU, ASIC...), and Attachment Method is Thermal Tape, Adhesive (Included), and the Height Off Base Height of Fin is 0.500" (12.70mm), and Thermal Resistance Forced Air Flow is 4.0°C/W @ 200 LFM, and the Material Finish is Black Anodized, and Designed for is BGA PGA PLCC QFP, and the Heatsink Material is Aluminum, and Thermal Resistance is 3.95 C/W, and the Fin Style is Vertical Fin.
The APF19-19-13CB is HEATSINK LOW-PROFILE FORGED, that includes 0.748" (19.00mm) Width, they are designed to operate with a Top Mount Type, Thermal Resistance Forced Air Flow is shown on datasheet note for use in a 4.0°C/W @ 200 LFM, that offers Shape features such as Square, Fins, Series is designed to work in APF, as well as the Assorted (BGA, LGA, CPU, ASIC...) Package Cooled, the device can also be used as Black Anodized Material Finish. In addition, the Material is Aluminum, the device is offered in 0.748" (19.00mm) Length, the device has a 0.500" (12.70mm) of Height Off Base Height of Fin, and Attachment Method is Thermal Tape, Adhesive (Not Included).
APF301-2 2908 with circuit diagram manufactured by GAPOLLO. The APF301-2 2908 is available in QFP80 Package, is part of the IC Chips.
