9icnet provides you with BPI0092 designed and produced by Balluff, which is sold in 9icnet on the spot, and can be purchased through channels such as the original factory and agents. BPI0092 price reference $161.42000. Balluff BPI0092 Package/Specification: CONNECTION SLOTS=8X M12X1-FEMALE. You can download BPI0092 english data, pin diagram, Datasheet data sheet function manual, the data contains detailed pin diagrams of diode rectifiers, application circuit diagrams of functions, voltages, usage methods and tutorials.
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The 133-PGM14013-10 is CONN SOCKET PGA GOLD, that includes PGM Series, they are designed to operate with a PGA Type, Packaging is shown on datasheet note for use in a Bulk, that offers Termination features such as Solder, it has an Operating Temperature range of -55°C ~ 105°C, as well as the Through Hole Mounting Type, the device can also be used as Polyamide (PA46), Nylon 4/6, Glass Filled Housing Material. In addition, the Pitch Mating is 0.100" (2.54mm), the device is offered in Gold Contact Finish Mating, the device has a 0.100" (2.54mm) of Pitch Post, and Contact Finish Post is Tin, and the Contact Finish Thickness Mating is 10μin (0.25μm), and Contact Material Mating is Beryllium Copper, and the Contact Finish Thickness Post is 200μin (5.08μm), and Contact Material Post is Brass.
133-PGM14013-10H with user guide, that includes PGA Type, they are designed to operate with a Solder Termination, Series is shown on datasheet note for use in a PGM, that offers Pitch Post features such as 0.100" (2.54mm), Pitch Mating is designed to work in 0.100" (2.54mm), as well as the Bulk Packaging, it has an Operating Temperature range of -55°C ~ 105°C. In addition, the Mounting Type is Through Hole, the device is offered in Polyamide (PA46), Nylon 4/6, Glass Filled Housing Material, the device has a Brass of Contact Material Post, and Contact Material Mating is Beryllium Copper, and the Contact Finish Thickness Post is 200μin (5.08μm), and Contact Finish Thickness Mating is 10μin (0.25μm), and the Contact Finish Post is Tin, and Contact Finish Mating is Gold.
133-PGM14014-40 with circuit diagram, that includes Gold Contact Finish Mating, they are designed to operate with a Tin Contact Finish Post, Contact Finish Thickness Mating is shown on datasheet note for use in a 10μin (0.25μm), that offers Contact Finish Thickness Post features such as 200μin (5.08μm), Contact Material Mating is designed to work in Beryllium Copper, as well as the Brass Contact Material Post, the device can also be used as Polyamide (PA46), Nylon 4/6, Glass Filled Housing Material. In addition, the Mounting Type is Through Hole, it has an Operating Temperature range of -55°C ~ 105°C, the device has a Bulk of Packaging, and Pitch Mating is 0.100" (2.54mm), and the Pitch Post is 0.100" (2.54mm), and Series is PGM, and the Termination is Solder, and Type is PGA.
133-PGM14014-50 with EDA / CAD Models, that includes Tin Contact Finish Post, they are designed to operate with a Through Hole Mounting Type, Termination is shown on datasheet note for use in a Solder, that offers Housing Material features such as Polyamide (PA46), Nylon 4/6, Glass Filled, Series is designed to work in PGM, as well as the PGA Type, the device can also be used as Gold Contact Finish Mating. In addition, the Packaging is Bulk, the device is offered in Brass Contact Material Post, the device has a Beryllium Copper of Contact Material Mating, it has an Operating Temperature range of -55°C ~ 105°C, and the Contact Finish Thickness Post is 200μin (5.08μm), and Contact Finish Thickness Mating is 10μin (0.25μm), and the Pitch Mating is 0.100" (2.54mm), and Pitch Post is 0.100" (2.54mm).
