9icnet provides you with FHA.00.304.CYCD35Z designed and produced by LEMO, which is sold in 9icnet on the spot, and can be purchased through channels such as the original factory and agents. FHA.00.304.CYCD35Z price reference $71.04000. LEMO FHA.00.304.CYCD35Z Package/Specification: CONN PLUG MALE 4POS GOLD CRIMP. You can download FHA.00.304.CYCD35Z english data, pin diagram, Datasheet data sheet function manual, the data contains detailed pin diagrams of diode rectifiers, application circuit diagrams of functions, voltages, usage methods and tutorials.
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FHA with pin details, that includes Edges, Irregular Holes For Use With Related Products, they are designed to operate with a Natural Color, Material is shown on datasheet note for use in a Polyamide (PA6), Nylon 6, that offers Series features such as Flexiform, Features is designed to work in Halogen-Free, as well as the UL94 HB Material Flammability Rating, the device can also be used as Edging - 82' L (25.00m) Panel Cutout Dimensions. In addition, the Panel Thickness is 0.015" ~ 0.059" (0.38mm ~ 1.50mm), the device is offered in Grommet - Edging, Slotted Bushing Grommet Type.
The FH9W4P5-1349 is D-Sub Mixed Contact Connectors 9W4P R/A CLINCH NUT, that includes Through Hole Termination Style, they are designed to operate with a Tin Shell Plating, Shell Material is shown on datasheet note for use in a Steel, that offers Number of Rows features such as 2 Row, Mounting Angle is designed to work in Right, as well as the Male Gender, the device can also be used as 5 A Current Rating. In addition, the Contact Plating is Gold, the device is offered in Copper Alloy Contact Material, the device has a 9W4 of Contact Arrangement.
The FH9W4P5-1161 is D-Sub Mixed Contact Connectors R/A PCB 40A PWR M3, that includes 9W4 Contact Arrangement, they are designed to operate with a Brass Contact Plating, Current Rating is shown on datasheet note for use in a 40 A, that offers Gender features such as Male.
FH8735 with EDA / CAD Models manufactured by FULHAN. The FH8735 is available in BGA Package, is part of the IC Chips.
