久芯网

VMUSIC3

  • 描述:材质: 塑料 附件种类: USB音频模块 色彩/颜色: 灰色 系列: Vinculum II 包装: 散装
  • 品牌: FTDI芯片 (FTDI)
  • 交期:5-7 工作日
渠道:
  • 自营
  • 得捷
  • 贸泽

起订量: 1

数量 单价 合计
1+ 305.50552 305.50552
  • 库存: 0
  • 单价: ¥305.50552
  • 数量:
    - +
  • 总计: ¥305.51
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规格参数

  • 部件状态 可供货
  • 制造厂商 FTDI芯片 (FTDI)
  • 附配件种类 USB音频模块
  • 材质 塑料
  • 色彩/颜色 灰色
  • 配套使用/相关货物 USB设备
  • 系列 Vinculum II
  • 包装 散装

VMUSIC3 产品详情

The VMUSIC3 is an USB host and MP3/WMA player Vinculum-II Development Module. The default firmware of the VMUSIC3 supports audio playback and UART or SPI communication interfaces for integration into the target product. VMUSIC3 can be used to read MP3 and other audio format files from a USB flash disk, process the data and output the stereo audio through the line-out header and headphone jack. The VMUSIC3 is a drop in replacement for the VMusic2 for the majority of VMusic2 applications. VMUSIC3 uses firmware called V2MSC which is similar to V2DAP (used in VDrive3) with an additional module for controlling MP3 playback. However for a small number of applications that use SPI, differences exists between VMusic firmware and V2MSC firmware which would require some changes to be made to the application software.

Feature

  • MP3 and WMA playback
  • USB A type socket to connect to USB client devices
  • 2mm (0.08") pitch 8-pin header used for the UART/SPI interface
  • Connects directly and communicates with a FTDI TTL-232R-3V3-2mm USB-UART cable
  • Jumper selectable UART and SPI interfaces, both operating 3.3V TTL/CMOS
  • Pre-programmed with V2MSC firmware
  • Vinculum-II debugger module port under the enclosure, for changing the firmware and debugging
  • UART programming mode control pins PROG# and RESET# are connected to an internal header
  • Reprogrammable over USB port from flash drive
VMUSIC3所属分类:音频配件,VMUSIC3 由 FTDI芯片 (FTDI) 设计生产,可通过久芯网进行购买。VMUSIC3价格参考¥305.505522,你可以下载 VMUSIC3中文资料、PDF数据手册、Datasheet数据手册功能说明书,可查询VMUSIC3规格参数、现货库存、封装信息等信息!

FTDI芯片 (FTDI)

FTDI芯片 (FTDI)

FTDI Chip 是一家成立于 1992 年的无晶圆厂半导体公司,与世界领先的代工厂合作。总部位于英国格拉斯哥,FTDI 芯片开发创新的硅解决方案,增强与当今技术的互动。通过应用其“简化设计”的理念,...

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