久芯网

66AK2H06DAAW2

  • 描述:种类: DSP+ARM 连接口: EBI/EMI、以太网、DMA、IC、 串行RapidIO、SPI、UART/USART、USB 3.0 非易失性内存: ROM(384kB) 供应商设备包装: 1517-FCBGA(40x40) 工作温度: 0摄氏度~85摄氏度(TC) 安装类别: 表面安装
  • 品牌: 德州仪器 (Texas)
  • 交期:5-7 工作日
渠道:
  • 自营
  • 得捷
  • 贸泽

起订量: 21

  • 库存: 0
  • 单价: ¥3,769.73288
  • 数量:
    - +
  • 总计: ¥79,164.39
在线询价

温馨提示: 请填写以下信息,以便客户代表及时与您沟通联系。

规格参数

  • 部件状态 可供货
  • 制造厂商 德州仪器 (Texas)
  • 安装类别 表面安装
  • 核心电压 可变参数
  • 工作温度 0摄氏度~85摄氏度(TC)
  • 种类 DSP+ARM
  • 连接口 EBI/EMI、以太网、DMA、IC、 串行RapidIO、SPI、UART/USART、USB 3.0
  • 时钟速度比率 1.2GHz
  • 非易失性内存 ROM(384kB)
  • 片上RAM 8.375MB
  • 输入/输出电压 0.85伏、1.0伏、1.35伏、1.5伏、1.8伏、3.3伏
  • 包装/外壳 1517-BBGA,FCBGA
  • 供应商设备包装 1517-FCBGA(40x40)

66AK2H06DAAW2 产品详情

The 66AK2Hxx platform combines the quad ARM Cortex-A15 processor with up to eightTMS320C66x high-performance DSPs using the KeyStone II architecture. The 66AK2H14/12/06 deviceprovides up to 5.6 GHz of ARM and 9.6 GHz of DSP processing coupled with security, packetprocessing, and Ethernet switching at lower power than multichip solutions. The 66AK2H14/12/06device is optimal for embedded infrastructure applications like cloud computing, media processing,high-performance computing, transcoding, security, gaming, analytics, and virtual desktop.

The C66x core combines fixed-point and floating-point computational capability in theprocessor without sacrificing speed, size, or power consumption. The raw computational performanceis 38.4 GMACS/core and 19.2 Gflops/core (@ 1.2 GHz operating frequency). The C66x is also 100%backward compatible with software for C64x+ devices. The C66x core incorporates 90 new instructionstargeted for floating point (FPi) and vector math oriented (VPi) processing.

The 66AK2H14/12/06 device has a complete set of development tools that includes: a Ccompiler, an assembly optimizer to simplify programming and scheduling, and aWindows debugger interface forvisibility into source code execution.

Feature

  • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With
    • 1.0 GHz or 1.2 GHz C66x Fixed- and Floating-Point DSP Core
      • 38.4 GMacs/Core for Fixed Point @ 1.2 GHz
      • 19.2 GFlops/Core for Floating Point @ 1.2 GHz
    • Memory
      • 32-KB L1P Per CorePac
      • 32-KB L1D Per CorePac
      • 1024-KB Local L2 Per CorePac
  • ARM CorePac
    • Four ARM Cortex-A15 MPCore Processors at up to 1.4 GHz
    • 4MB of L2 Cache Memory Shared by Four ARM Cores
    • Full Implementation of ARMv7-A Architecture Instruction Set
    • 32-KB L1 Instruction and Data Caches per Core
    • AMBA 4.0 AXI Coherency Extension (ACE) Master Port, Connected to MSMC for Low-Latency Access to Shared MSMC SRAM
  • Multicore Shared Memory Controller (MSMC)
    • 6MB of MSM SRAM Memory Shared by Eight DSP CorePacs and One ARM CorePac
    • Memory Protection Unit (MPU) for Both MSM SRAM and DDR3_EMIF
  • Multicore Navigator
    • 16k Multipurpose Hardware Queues With Queue Manager
    • Packet-Based DMA for Zero-Overhead Transfers
  • Network Coprocessor
    • Packet Accelerator Enables Support for
      • Transport Plane IPsec, GTP-U, SCTP, PDCP
      • L2 User Plane PDCP (RoHC, Air Ciphering)
      • 1-Gbps Wire Speed Throughput at 1.5 MPackets Per Second
    • Security Accelerator Engine Enables Support for
      • IPSec, SRTP, 3GPP, and WiMAX Air Interface, and SSL/TLS Security
      • ECB, CBC, CTR, F8, A5/3, CCM, GCM, HMAC, CMAC, GMAC, AES, DES, 3DES, Kasumi, SNOW 3G, SHA-1, SHA-2 (256-Bit Hash), MD5
      • Up to 2.4 Gbps IPSec and 2.4 Gbps Air Ciphering
    • Ethernet Subsystem
      • Five-Port Switch (Four SGMII Ports)
  • Peripherals
    • Four Lanes of SRIO 2.1
      • Supports up to 5 GBaud
      • Supports Direct I/O, Message Passing
    • Two Lanes PCIe Gen2
      • Supports up to 5 GBaud
    • Two HyperLinks
      • Supports Connections to Other KeyStone Architecture Devices Providing Resource Scalability
      • Supports up to 50 GBaud
    • 10-Gigabit Ethernet (10-GbE) Switch Subsystem (66AK2H14 Only)
      • Two XFI Ports
      • IEEE 1588 Support
    • Five Enhanced Direct Memory Access (EDMA) Modules
    • Two 72-Bit DDR3/DDR3L Interfaces With Speeds up to 1600 MHz
    • EMIF16 Interface
    • USB 3.0
    • Two UART Interfaces
    • Three I2C Interfaces
    • 32 GPIO Pins
    • Three SPI Interfaces
    • Semaphore Module
    • 64-Bit Timers
      • Twenty 64-Bit Timers for 66AK2H14 and 66AK2H12
      • Fourteen 64-Bit Timers for 66AK2H06
    • Five On-Chip PLLs
  • Commercial Case Temperature:
    • 0oC to 85oC
  • Extended Case Temperature:
    • –40oC to 100oC
66AK2H06DAAW2所属分类:数字信号处理器(DSP),66AK2H06DAAW2 由 德州仪器 (Texas) 设计生产,可通过久芯网进行购买。66AK2H06DAAW2价格参考¥3769.732878,你可以下载 66AK2H06DAAW2中文资料、PDF数据手册、Datasheet数据手册功能说明书,可查询66AK2H06DAAW2规格参数、现货库存、封装信息等信息!

德州仪器 (Texas)

德州仪器 (Texas)

德州仪器公司(TI)是一家开发模拟IC和嵌入式处理器的全球半导体设计和制造公司。通过雇用世界上最聪明的人,TI创造了塑造技术未来的创新。如今,TI正在帮助超过10万名客户改变未来。

会员中心 微信客服
客服
回到顶部