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OSD32MP157F-512M-BAA

  • 描述:模块/板卡类型: MPU核心 连接端子种类: 302-BGA 处理器核心: 臂双皮质-A7,手臂皮质-M4 速度: 800MHz 工作温度: 0摄氏度~85摄氏度
  • 品牌: 奥克塔沃系统有限公司 (Octavo Systems )
  • 交期:5-7 工作日
渠道:
  • 自营
  • 得捷
  • 贸泽

起订量: 1

  • 库存: 0
  • 单价: ¥5,550.91510
  • 数量:
    - +
  • 总计: ¥5,550.92
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规格参数

  • 部件状态 可供货
  • 模块/板卡类型 MPU核心
  • 工作温度 0摄氏度~85摄氏度
  • 速度 800MHz
  • RAM大小 512MB
  • 闪存的大小 -
  • 辅助协同处理器 霓虹灯SIMD
  • 制造厂商 奥克塔沃系统有限公司 (Octavo Systems )
  • 处理器核心 臂双皮质-A7,手臂皮质-M4
  • 连接端子种类 302-BGA
  • 大小/尺寸 0.71英寸x 0.71英寸(18毫米x 18毫米)

OSD32MP157F-512M-BAA 产品详情

Octavo Systems OSD335x System-In-Packages (SiP) are designed to easily implement cost-effective products based on the ARM� Cortex�-A8 Core. The OSD335x are housed in easy to use, very small packages making them perfect for size constrained applications. The devices incorporate a Texas Instruments AM335x Sitara Processor, TPS65217C Power Management IC, TL5209 LDO Voltage Regulator, a DDR3 SDRAM, and over 140 passive components. The OSD335x SiPs allows designers to focus on key system aspects without spending time on complicated high-speed processor/DDR3 interface design. A reduction to the overall size and complexity of the design allows the OSD335x to decrease time to market for AM335x-based products.

Octavo Systems' OSD335x family of SiP products are building blocks designed to allow easy and cost-effective implementation of systems based on Texas Instruments’ powerful Sitara™ AM335x line of processors. The OSD335x integrates the AM335x along with the TI TPS65217C PMIC and TI TL5209 LDO, up to 1 GB of DDR3 memory, and over 140 resistors, capacitors, and inductors all into a single design-in-ready package.

IC SIP BASED ON TI AM3358 400BGA

OSD32MP157F-512M-BAA所属分类:微控制器/微处理器/现场可编程模块,OSD32MP157F-512M-BAA 由 奥克塔沃系统有限公司 (Octavo Systems ) 设计生产,可通过久芯网进行购买。OSD32MP157F-512M-BAA价格参考¥5550.915103,你可以下载 OSD32MP157F-512M-BAA中文资料、PDF数据手册、Datasheet数据手册功能说明书,可查询OSD32MP157F-512M-BAA规格参数、现货库存、封装信息等信息!
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