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The HBA68MFZRE is RES 68M OHM 0.8W 1% RADIAL, that includes HB, CGS Series, they are designed to operate with a Tray Packaging, Height is shown on datasheet note for use in a 0.492" (12.50mm), that offers Package Case features such as Radial, it has an Operating Temperature range of -55°C ~ 125°C, as well as the High Voltage Features, the device can also be used as 0.315" L x 0.102" W (8.00mm x 2.60mm) Size Dimension. In addition, the Supplier Device Package is Radial Lead, the device is offered in 0.8W Power Watts, the device has a 68M of Resistance Ohms, and Tolerance is ±1%, and the Number of Terminations is 2, and Temperature Coefficient is ±100ppm/°C, and the Composition is Thick Film.
The HBA82MFZRE is RES 82M OHM 0.8W 1% RADIAL, that includes ±1% Tolerance, they are designed to operate with a ±100ppm/°C Temperature Coefficient, Supplier Device Package is shown on datasheet note for use in a Radial Lead, that offers Size Dimension features such as 0.315" L x 0.102" W (8.00mm x 2.60mm), Series is designed to work in HB, CGS, as well as the 82M Resistance Ohms, the device can also be used as 0.8W Power Watts. In addition, the Packaging is Tray, the device is offered in Radial Package Case, it has an Operating Temperature range of -55°C ~ 125°C, and Number of Terminations is 2, and the Height is 0.492" (12.50mm), and Features is High Voltage, and the Composition is Thick Film.
HBA8205 with circuit diagram manufactured by TI. The HBA8205 is available in DIP-8 Package, is part of the IC Chips.
