The BOOK GAN FET parts manufactured by EPC are available for purchase at 9icnet Electronics. Here you can find various types and values of electronic parts from the world's leading manufacturers. The BOOK GAN FET components of 9icnet Electronics are carefully chosen, undergo stringent quality control, and are successfully meet all required standards.
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BOND PLY 660P 11X12" with pin details, that includes Brown Color, they are designed to operate with a Polyimide Material, Series is shown on datasheet note for use in a Bond-PlyR 660P, that offers Shape features such as Rectangle, Thickness is designed to work in 0.008" (0.203mm), as well as the 304.80mm x 279.40mm Outline, the device can also be used as Adhesive - Both Sides Adhesive. In addition, the Usage is Sheet, the device is offered in Polyimide Backing Carrier, the device has a 0.81°C/W of Thermal Resistivity, and Thermal Conductivity is 0.4 W/m-K.
BONAESD C2291 with user guide manufactured by PHI. The BONAESD C2291 is available in TSSOP Package, is part of the IC Chips.
Bone Microphone with circuit diagram manufactured by Dotlink. is part of the IC Chips.
