• SPI-compatible serial bus interface
• Single and double transfer rate (STR/DTR)
• Clock frequency
– 166 MHz (MAX) for all protocols in STR
– 90 MHz (MAX) for all protocols in DTR
• Dual/quad I/O commands for increased throughput up to 90 MB/s
• Supported protocols in both STR and DTR
– Extended I/O protocol
– Dual I/O protocol
– Quad I/O protocol
• Execute-in-place (XIP)
• PROGRAM/ERASE SUSPEND operations
• Volatile and nonvolatile configuration settings
• Software reset
• Additional reset pin for selected part numbers
• Dedicated 64-byte OTP area outside main memory
– Readable and user-lockable
– Permanent lock with PROGRAM OTP command
• Erase capability
– Bulk erase
– Sector erase 64KB uniform granularity
– Subsector erase 4KB, 32KB granularity
• Security and write protection
– Volatile and nonvolatile locking and software write protection for each 64KB sector
– Nonvolatile configuration locking
– Password protection
– Hardware write protection: nonvolatile bits (BP[3:0] and TB) define protected area size
– Program/erase protection during power-up
– CRC detects accidental changes to raw data
• Electronic signature
– JEDEC-standard 3-byte signature (BB18h)
– Extended device ID: two additional bytes identify device factory options
• JESD47H-compliant
– Minimum 100,000 ERASE cycles per sector
– Data retention: 20 years (TYP)
Options Marking
• Voltage
– 1.7–2.0V U
• Density
– 128Mb 128
• Device stacking
– Monolithic A
• Device generation B
• Die revision A
• Pin configuration
– RESET# and HOLD# 8
• Sector Size
– 64KB E
• Packages – JEDEC-standard, RoHScompliant
– 24-ball T-PBGA, 05/6mm x 8mm (5 x 5 array)
12
– 24-ball T-PBGA 05/6mm x 8mm (4 x 6 array)
14
– Wafer level chip-scale package,15 balls , 9 active balls (XFWLBGA 0.5P)
54
– 8-pin SOP2, 208 mils body width (SO8W)
SE
– 16-pin SOP2, 300 mils body width (SO16W)
SF
– W-PDFN-8 6mm x 5mm (MLP8 6mm x 5mm)
W7
– W-PDFN-8 8mm x 6mm (MLP8 8mm x 6mm)
W9
• Standard security 0
• Special options
– Standard S
– Automotive A
• Operating temperature range
– From –40°C to +85°C IT
– From –40°C to +105°C AT
• Voltage
– 1.7–2.0V U
• Density
– 128Mb 128
• Device stacking
– Monolithic A
• Device generation B
• Die revision A
• Pin configuration
– RESET# and HOLD# 8
• Sector Size
– 64KB E
• Packages – JEDEC-standard, RoHScompliant
– 24-ball T-PBGA, 05/6mm x 8mm (5 x 5 array)
12
– 24-ball T-PBGA 05/6mm x 8mm (4 x 6 array)
14
– Wafer level chip-scale package,15 balls , 9 active balls (XFWLBGA 0.5P)
54
– 8-pin SOP2, 208 mils body width (SO8W)
SE
– 16-pin SOP2, 300 mils body width (SO16W)
SF
– W-PDFN-8 6mm x 5mm (MLP8 6mm x 5mm)
W7
– W-PDFN-8 8mm x 6mm (MLP8 8mm x 6mm)
W9
• Standard security 0
• Special options
– Standard S
– Automotive A
• Operating temperature range
– From –40°C to +85°C IT
– From –40°C to +105°C AT
(Picture:Pinout / Diagram)
